In a significant stride toward strengthening India’s semiconductor ecosystem, the Union Cabinet on Wednesday approved the establishment of a new semiconductor manufacturing facility in Uttar Pradesh. The plant, a joint venture between Indian tech leader HCL and Taiwanese electronics major Foxconn, marks the sixth unit under the India Semiconductor Mission (ISM).
The upcoming facility will be strategically located near Jewar Airport within the Yamuna Expressway Industrial Development Authority (YEIDA) region. With an investment of ₹3,700 crore, the plant is set to produce display driver chips used in a variety of devices ranging from smartphones and laptops to cars and consumer electronics.
Designed with a monthly production capacity of 20,000 wafers and an output of approximately 36 million chips, the project is expected to be a game-changer for India’s ambitions to become a global semiconductor hub. It will also create new opportunities for high-tech employment and boost domestic supply chains.
The approval comes at a time when India’s semiconductor sector is witnessing unprecedented momentum. Five other semiconductor fabrication units are already under construction, and India’s capabilities in design innovation have gained international attention. At present, over 270 academic institutions and 70 startups are engaged in semiconductor R&D. Notably, 20 chip designs by student-led teams have already been taped out through the Semiconductor Laboratory (SCL) in Mohali.
